Encapsulation Materials for Micro LED - IEBS Case Study
Micro-LED without encapsulation materials cannot meet the requirements to use; thus, a specific encapsulation is needed to provide mechanical protection, effective heat dissipation, electric connections, and high efficiency and quality light output. The encapsulation forms used on micro-LEDs are:
· Chip-type
SMD encapsulation
· N-in-one
IMD encapsulation
· COB
encapsulation
The Challenge
The demand
for high-power micro-LED is growing exponentially, so it becomes more relevant
to increase the demand for encapsulation materials. The micro-LEDs are used in
devices to enhance their efficiency and provide high brightness, which comes
with the challenges like heat dissipation, outside protection, and transparent
surface. High-power micro-LEDs have an advantage in the automotive application
and general lighting owing to efficient working for extended operating hours
and low maintenance costs.
For
micro-LEDs, organic encapsulant materials used are acrylic resin, epoxy resin,
and phenolic resin; and some of the inorganic encapsulant materials used are
silicon nitride layer, silicon oxynitride layer, and silicon oxide layer.
Moreover, the encapsulants provide thermal transfer and light emission, which
align with the addressable need of mid-and high-power micro-LEDs. Thus, the
micro-LED encapsulation market is expected to grow substantially during the
forecast period.
To know about the solution, we provided and for more inquiries,
please visit@ https://www.iebrain.com/case-studies/encapsulation-materials-for-micro-led/
Business Impact
We provided the client with actionable recommendations
on a few types of materials used for the encapsulation of micro-LEDs and their
effects:
· The client was able to understand the
increase in demand and popularity of materials.
· The client gained clear insights into
overall trends in the utilization of encapsulation materials for the use of
different situations.
· The client was able to prioritize a few
of the materials for their business. Epoxy resin, epoxy molding compounds,
silica gel, organic silica gel, Silicone and silicone-based, polyurethane-based,
acylate-based, phenyl-based, Internal filling of metal and ceramic materials,
and other classes of materials.
· The client gained perspective on various
solutions & approaches competitors are adopting to address the challenges
associated with encapsulation materials of micro-LED.
· The client understood competitors’
strategies for minimizing costs and achieving their goals.
· The client got insights on implemented
success stories/use cases for a few solutions to establish confidence for
collaboration opportunities with solution providers.
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