Encapsulation Materials for Micro LED - IEBS Case Study
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Micro-LED without encapsulation materials cannot meet the requirements to use; thus, a specific encapsulation is needed to provide mechanical protection, effective heat dissipation, electric connections, and high efficiency and quality light output. The encapsulation forms used on micro-LEDs are: · Chip-type SMD encapsulation · N-in-one IMD encapsulation · COB encapsulation The Challenge The demand for high-power micro-LED is growing exponentially, so it becomes more relevant to increase the demand for encapsulation materials. The micro-LEDs are used in devices to enhance their efficiency and provide high brightness, which comes with the challenges like heat dissipation, outside protection, and transparent surface. High-power micro-LEDs have an advantage in the automotive application and general lighting owing to efficient working for extended operating hours and low maintenance costs. For micro-LEDs, organic encapsulant materials used are acrylic resin, epoxy resin,